Microstructural Analysis of the Bonding Interface between Thick Al Wire and Al-1 mass%Si Electrode Film
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چکیده
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Ultrasonic friction power during Al wire wedge-wedge bonding
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ژورنال
عنوان ژورنال: Materials Transactions, JIM
سال: 1996
ISSN: 0916-1821,2432-471X
DOI: 10.2320/matertrans1989.37.1324